Silicon Carbide Wafer

Category Silicon Carbide Ceramics

Additional information

Material	SSiC
Outer Diamerter	Up to 800mm
Thickness	Down to 0.5mm, Down to 1mm
Forming	Dry-pressing, Isostatic-presssing
Processing	RBSiC/SSiC/SiSiC, Reaction Bonded/Pressureless
Customization	Send us your drawing to get our best offers

Product Details:

Silicon carbide ceramics have the best oxidation resistance among carbides, but between 1000-1400°C, the oxidation rate of SiC in the air is higher. The volume resistivity of silicon carbide does not change much in the range of 1000-1500°C. With their good chemical stability, high mechanical strength, and thermal shock resistance. Silicon carbide wafers are widely applied in the semiconductor, solar photovoltaic industries.

SSiC material properties:

Composite	(wt %)	SSiC
Color		Black
Density	g/cm³	3.15
Hardness	HRA	28
Flexural Strength	Mpa(psi*10³ )	380
Gas Permeability		0
Water Absorption	%	0
Thermal Shock Resistance	°C	–
Thermal Expansion	×10^-6/℃	4
Dielectric Constant,20°C	1MHz	–
Dielectric loss, tanδ	1MHz	2×10¹⁴
Volume Resistivity,20℃	Ω·cm	10²-10⁸
Dielectric Strength,DC	Ω·cm	–
Compressive Strength	KV/mm	3900
Fracture Toughness	MPa( psi * 10³)	4
Poisson’s Ratio	MPa	0.14
Thermal conductivity	W/mK	120

Type:

Silicon Carbide Ceramic Wafer

Material:

Sintered Silicon Carbide

Available Color:

Black

Feature:

High-Heat Resistance.High Corrosion-Resistance, Excellent Wear-Resistance.High Surface Roughness.

Size:

Size Customized, according to customer’s drawing, OEM.

Application:

Technical ceramic.Advanced ceramic.Semiconductor ceramic.

Advantage:

Tight Tolerances
Excellent Surface Treatment
Large outside diameter options, we can reach the largest size to 800mm.
Excellent Wear-Resistance
Vairous Delivery Options
19 more Years Advanced Ceramics Experience
Fast Delivery
Sample projects available
Free Molding Charge
Ultrasonic cleaning and dust-free packaging

Package:

Carton+Palletize,Carton,bubble paper inside,Wooden Box.Pls let us know if you have any special requirements.

Producing Methods:

CNC machining with Fine Lapping. Isostatic pressing.Pressureless Sintering.

Tolerance:

Up to ±0.001mm, as customer’s drawing or OEM.

Surface:

Excellent Surface Treatment or according to customer’s requirements.

Packaging and Delivery

Packaging:

Standard: Paper wooden boxes.
Special: Pls let us know if you have any special requirements.

Lead time:

For sample orders: We usually can finish them in 20 days.
Mass Production: The best lead time for mass-production could be in 30 days.

Transportation options:

By Air Express (Door to door)

The time limit is very fast (usually will arrive in 5-7 days )and you do not need to pick up the goods by yourself.

Freight charge: higher.

By Air Transportation

The time limit is very fast (usually will arrive in 7-12 days) and you need to pick up the goods from the airport by yourself.

Freight charge: cheaper than air express.

By Sea

The time limit is slow and you need to pick up the goods from the destination port by yourself.

Freight charge: cheapest.

Silicon Carbide Wafer

Additional information